Clear Cushion Vacuum Pouch for Electronic Components

• Application: Promotion, Household, Chemical
• Feature: Moisture Proof, Recyclable, Bio-Degradable, Shock Resistance, Antistatic
• Material: Laminated Material
• Shape: Seal Bag
• Making Process: Composite Packaging Bag
• Raw Materials: High Pressure Polyethylene Plastic Bag
• Model NO.: CEB-003
• Bag Variety: Back Seal Bags
• Size: as Per Cutomer′s Requiement
• Thickness: Available in Customized
• Product Specification: Customizable
• Introduces Features: Waterproof, Moisture-Proof, and Anti-Static
• Transport Package: as Required
• Specification: SGS ROHS report
• Trademark: DIASAP
• Origin: China Suzhou
• HS Code: 3005909000
• Production Capacity: 100million Tonf Year

Product Description

Clear Cushion Pouch for Electronic Components

 

This Clear Vacuum Bag  is usually composed of two&three layers, and can protect inside products from static and moisture,different from common extrusion PE bag, our laminated material is more suitable in vacuum packing with its low MVTR and OTR.

Transparent color is convenient to identify inner products.Various thinckness and printing service are available, different bag types are can be customized.

The Plastic Vacuum Bag is mainly applied to pack electronic components(PCB,IC,HD driver), precise equipment and so on.

The third party reports can be offered, such as ROHS, Halogen testing report.This material meets the environment requirement of EU and North America in package.

 

Product Description
Product Name	Clear Cushion Pouch for Electronic Components
Material Structure	Layers Laminated Material:   PET/NY/PE       NY/PE
Feature	Anti-static, moisture barrier,anti-tearing,anti-puncture
Printing	Customized
Surface Resistance	10^6~10^11 Ohm
Thickness	Customized(0.08-0.2mm available)
Bag Style	Open top/ zip lock
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment...

 

Clear Cushion Pouch for Electronic Components Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.1g/100in²/24hs
5	Heat-Seal Temperature		160%±10%
6	Heat-Seal Pressure		70Pa
7	Heat-Seal Time		≤1.5S

 

Detailed Photos

 

Factory show:

 

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