• Antistatic Printed Shielding Bags for Packing Electronic Components
  • Antistatic Printed Shielding Bags for Packing Electronic Components
  • Antistatic Printed Shielding Bags for Packing Electronic Components
  • Antistatic Printed Shielding Bags for Packing Electronic Components
  • Antistatic Printed Shielding Bags for Packing Electronic Components
  • Antistatic Printed Shielding Bags for Packing Electronic Components

Antistatic Printed Shielding Bags for Packing Electronic Components

Application: PC Board, IC, CD Driver, HD Pack
Feature: Moisture Proof, Recyclable, Antistatic
Material: Laminated Material
Shape: Open Top, Zip Lock, Gusset Bag
Making Process: Composite Packaging Bag
Raw Materials: APET/PE APET/CPP
Customization:
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Manufacturer/Factory

Basic Info.

Model NO.
SZ-S001
Bag Variety
Open Top Bag, Zip Lock Bag
Function
Anti Static
Industrial Use
Electronic Components, Semiconductive Industry
Color
Semi-Transparent
Surface Handling
Gravure Printing
Bag Type
Open Top, Zip Lock, Gusset
Customized
Yes
Transport Package
50 - 100PCS Per Bag, 5 - 50 Bags / Carton
Specification
SGS ROHS report
Trademark
DIASAP
Origin
Suzhou, China
HS Code
3923210000
Production Capacity
200000 PCS/Day

Product Description

Antistatic Shielding Bags for Packing Electronic Components

 
 1. This ESD shielding bag is designed to provide a static safe environment for senstitive electronic devices.
 2. Bags are printed with an ESD warning symbol and a lot code for tracing.
 3. Open top and zip lock styles are
available.
 4. Translucent color is convenient to distinguish inside products.


Product Show:
 
Product Description:
Product Name Antistatic Printed Shielding Bags for Packing Electronic Components
Material Structure Layers Laminated Materials
PET-AL/PE            PET-AL/CPP
Feature Anti-static, moisture barrier
Printing Can Be Customized
Surface Resistance 10^6~10^11 Ohm
Thickness Can Be Customized
Bag Style Open top , Zip lock
Package 50~100pcs per bag and then in cartons or as 
per customer's request
 
Usage
Esd Shielding Bag is widely used in packing of all precise components and electronic kits which sensitive to static.
 
Technical Parameters:
 
NO. Item Standard Result
1 Surface resistivity ASTM D-257 10^6-10^11ohm
2 Decay time  IEC61340-5-1 <0.3s
3 Light Transmission Rate ASTM D-1003 40%±5%
4 Heat-Seal Temperature   150%±10%
5 Heat-Seal Pressure   50Pa
6 Heat-Seal Time   ≤1S
 
 Product Picture:


Antistatic Printed Shielding Bags for Packing Electronic Components
Antistatic Printed Shielding Bags for Packing Electronic Components


Factory show:
Antistatic Printed Shielding Bags for Packing Electronic Components


Contact us:
Abby Huo
Suzhou SKY Industrial Co., Ltd.
Add.: 36# Zhong'An Road, Puzhuang, Suzhou, Jiangsu, China
Zip code: 215105
Tel: +8613270975606
 
   

Free samples will be sent for your evaluation! 

 
 

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