Aluminum Foil ESD Zipper Bag for DIP Tubes

• Application: Food, Promotion, Household, Chemical, Apparel, Pricise Equipment, PC Board, IC, CD Driver
• Feature: Moisture Proof, Recyclable, Bio-Degradable, Shock Resistance, Antistatic, Light Isolation
• Material: Laminated Material
• Shape: Open Top, Ziplock, Three Dimensional, Gusset
• Making Process: Composite Packaging Bag
• Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE
• Model NO.: SZ-MB002
• Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
• Function: Anti Static, Moisture Barrier, Light Isolation
• Industrial Use: Electronic Components, Semiconductive Industry
• Color: Silver
• Surface Handling: Gravure Printing
• Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
• Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
• Specification: SGS ROHS report
• Trademark: DIASAP
• Origin: Suzhou, China
• HS Code: 3923210000
• Production Capacity: 200000 PCS/Day

Product Description

Aluminum Foil ESD Zipper Bag for DIP Tubes

 

1.Aluminum Foil Zipper Bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

2.The Aluminum Bag's middle metal layer is pure aluminum layer, which has distinctive moisture barrier and light isolation properties.
 

3.The moisture Barrier Bag is mainly applied to pack static sensitive electronic components (PCB,IC,HD driver), precise equipment and chemical raw material etc.

4.Various Aluminium Foil Vacuum Bag styles can be customized such as open-end bag, zip-lock bag, gusset bag and so on. The all kinds of printing services are available.

5.The third party reports can be offered, such as ROHS,Halogen testing report.

 
 

Product Description
Product Name	Aluminum Foil ESD Zipper Bag for DIP Tubes
Material Structure	Layers Laminated Material: PET/AL/NY/PE  BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	Customized
Surface Resistance	10^6~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	Open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.

 

Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 

Detailed Photos

 

Factory show:

 

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