• Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
  • Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
  • Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
  • Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
  • Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
  • Muli-Layers Lamination Aluminum Foil Bag for IC Packaging

Muli-Layers Lamination Aluminum Foil Bag for IC Packaging

Application: Promotion, Household, Chemical, Apparel, Electronic Products
Feature: Moisture Proof, Recyclable, Bio-Degradable, Disposable, Shock Resistance, Antistatic
Material: Laminated Material
Shape: Seal Bag
Making Process: Composite Packaging Bag
Raw Materials: High Pressure Polyethylene Plastic Bag
Customization:

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Basic Info.

Model NO.
sky-004
Bag Variety
Back Seal Bags
Size
as Per Cutomer′s Requiement
Thickness
as Per Cutomer′s Requiements
Printing
Machine Printing
Color
Silver
Transport Package
as Required
Specification
RoHS report
Trademark
DIASAP
Origin
China Suzhou
HS Code
3923210000
Production Capacity
100million Ton/ Year

Product Description

Muli-layers Lamination Aluminum Foil Bag for IC Packaging
 
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.

ts the environment requirement of EU and North America in package.

 
 
Product Description
Product Name Muli-layers Lamination Aluminum Foil Bag for IC Packaging
 
Material Structure
Layers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE
Feature Anti-static, moisture barrier,light isolation
Printing Customized
Surface Resistance 10^8~10^11 Ohm
Thickness Customized(0.06--0.2mm available)
Bag Style Open top/ zip lock/ envelope/ gusset/ three dimensional
Package 50~100pcs per bag and then in cartons or as per customer's request
 
Usage
Electronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc.
 
Technical Parameters:
NO. Item Standard Result
1 Puncture Strength MIL-STD-3010B ≥24LBF
2 Surface resistivity ASTM D-257 10^6-10^11ohm
3 Decay time  IEC61340-5-1 <0.3s
4 WVTR ASTM F1249 ≤0.0006g/100in²/24hs
5 OTR ASTM D3985 ≤0.01cc/100in²/24hs
6 Heat-Seal Temperature   160%±10%
7 Heat-Seal Pressure   70Pa
8 Heat-Seal Time   ≤1.5S
 
Product Pictures: 

Muli-Layers Lamination Aluminum Foil Bag for IC Packaging

Factory Show:
Muli-Layers Lamination Aluminum Foil Bag for IC Packaging
 
Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 


   

Free samples will be sent for your evaluation!   

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