Gold Member Since 2015
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Suzhou Sky Industrial Co., Ltd.

Moisture Barrier Bag, ESD Bag, Printed Bag manufacturer / supplier in China, offering Printed Moisture Barrier Bag for Chip Packing with SGS, Anti-Static Packaging Bag with Lamination Film, Anti Static ESD Shielding Ziplock Bag with RoHS Certificated and so on.

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Supplier Homepage Product Moisture Barrier Bags Printed Moisture Barrier Bag for Chip Packing with SGS

Printed Moisture Barrier Bag for Chip Packing with SGS

FOB Price: US $0.2 / Piece
Min. Order: 2,000 Pieces
Min. Order FOB Price
2,000 Pieces US $0.2/ Piece
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Port: Shanghai, China
Production Capacity: 100million Ton/ Year
Payment Terms: T/T

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Basic Info
  • Model NO.: MBB002
  • Feature: Moisture Proof, Bio-Degradable, Shock Resistance, Antistatic
  • Shape: Flat-Open Bag
  • Raw Materials: High Pressure Polyethylene Plastic Bag
  • Size: as Per Cutomer′s Requiement
  • Transport Package: as Required
  • Origin: China Suzhou
  • Application: Promotion, Household, Chemical, Electronic Products
  • Material: Laminated Material
  • Making Process: Composite Packaging Bag
  • Bag Variety: Back Seal Bags
  • Trademark: DIASAP
  • Specification: SGS RoHS report
  • HS Code: 3005909000
Product Description
Printed Moisture Barrier Bag for Chip Packing with SGS
 
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.


This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 
Product Description
Product NamePrinted Moisture Barrier Bag for Chip Packing with SGS
 
Material Structure
Layers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE
FeatureAnti-static, moisture barrier,light isolation
PrintingCustomized
Surface Resistance10^6~10^11 Ohm
ThicknessCustomized(0.06--0.2mm available)
Bag StyleOpen top/ zip lock/ envelope/ gusset/ three dimensional
Package50~100pcs per bag and then in cartons or as per customer's request
 
Usage
Electronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc.
 
Printed Moisture Barrier Bag for Chip Packing with SGS Technical Parameters:
NO.ItemStandardResult
1Puncture StrengthMIL-STD-3010B≥24LBF
2Surface resistivityASTM D-25710^6-10^11ohm
3Decay time IEC61340-5-1<0.3s
4WVTRASTM F1249≤0.0006g/100in²/24hs
5OTRASTM D3985≤0.01cc/100in²/24hs
6Heat-Seal Temperature 160%±10%
7Heat-Seal Pressure 70Pa
8Heat-Seal Time ≤1.5S
 
Product Pictures: 

Printed Moisture Barrier Bag for Chip Packing with SGS


Factory show:
Printed Moisture Barrier Bag for Chip Packing with SGS
 
Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 

Contact us:
Abby 
Suzhou SKY Industrial Co., Ltd.
Add.: 36# Zhong'An Road, Puzhuang, Suzhou, Jiangsu, China
Zip code: 215105
Tel: +8613270975606
 


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