Gold Member Since 2015
Audited Supplier
Suzhou Sky Industrial Co., Ltd.

Moisture Barrier Bag, Plastic Bag, Vacuum Bag manufacturer / supplier in China, offering Aluminum Foil Bags for IC or Chips Packing, ESD Static Shielding  Bag for PCB, Electronic Components Anti Static Bags and so on.

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Supplier Homepage Product ESD Moisture Barrier Bags Aluminum Foil Bags for IC or Chips Packing

Aluminum Foil Bags for IC or Chips Packing

Purchase Qty.:
(Pieces)
1,000-3,999 4,000+
FOB Unit Price: US $0.2 US $0.1
Purchase Qty. (Pieces) FOB Unit Price
1,000-3,999 US $0.2
4,000+ US $0.1
Get Latest Price
Production Capacity: 60tons/Month
Transport Package: Carton
Payment Terms: T/T

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Basic Info
  • Model NO.: sky037
  • Feature: Moisture Proof, Recyclable, Antistatic
  • Shape: Seal Bag
  • Size: as Per Cutomer′s Requiement
  • Printing: Machine Printing
  • Specification: SGS RoHS report
  • HS Code: 3923210000
  • Application: Electronics
  • Material: Laminated Material
  • Making Process: Composite Packaging Bag
  • Thickness: Customized
  • Color: Silver
  • Origin: Suzhou City, China
Product Description
Bag for SMT Reel packing is laminated with four single layers, PET/AL/NY/PE. We have our own dry lamination plant and can customize material structure according to users' specific packing purpose. The middle Aluminum metal layer is from top class famous manufacturer in China. It has good moisture barrier and light isolation properties. ESD moisture barrier bag is widely used in vacuum packing of static sensitive electronic components such as PCB, WAFER, CHIPS, REELs in SMT industry etc. For chemical raw material and medical intermediate packing, it is undoubtedly a very good choice. The third-party testing reports such as ROHS, Halogen, PFOA/PFOS, MVTR&OTR reports etc. are available. Various bag shapes can be produced such as open-end bag, zip-lock bag, gusset bag and so on. Please kindly offer us your detailed specification and we will offer you very favorable and exact prices. Supporting all our customers in development of new packaging solution is our featured service.
Specification:

NO.

Item

Unit

Test standard and result

1

Metal layer resistance

Ohm/sq

<0.1

2

Water Vapor

Transmission

Optical density

0.0006gm/100sq.in./24hrs

3

Surface resistivity

Ohm/sq

108-1011

4

Time for static removal

5000-0V

<0.01 sec FTMS 101 B Method 4046

5

Puncture resistance

P.S.I

ASTM  D3420      >100

7

MVTR

gm/100in-2/24hrs

ASTM  E  96      <0.2

8

Oxygen Barrier

CC/100in-2/24hrs

ASTM  D  3985    <0.5

9

Hot sealing temperature

F

250-375F

10

Seal strength

N/15mm

25.2




Aluminum Foil Bags for IC or Chips Packing

Aluminum Foil Bags for IC or Chips Packing
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