Gold Member Since 2015
Audited Supplier
Suzhou Sky Industrial Co., Ltd.

Moisture Barrier Bag, Packaging Bag, Zipper Bag manufacturer / supplier in China, offering Aluminum Foil Printed Bags for IC or Chips Packing, Moisture Barrier Bag for Large Equipment with SGS, ESD File Folder for Clean Room Use and so on.

(/ )

Supplier Homepage Product Moisture Barrier Bags Aluminum Foil Printed Bags for IC or Chips Packing

Aluminum Foil Printed Bags for IC or Chips Packing

Purchase Qty.:
(Pieces)
1,000-3,999 4,000+
FOB Unit Price: US $0.2 US $0.1
Purchase Qty. (Pieces) FOB Unit Price
1,000-3,999 US $0.2
4,000+ US $0.1
Get Latest Price
Port: Shanghai, China
Production Capacity: 60tons/Month
Payment Terms: T/T

Request a custom order and have something just for you!

Send Customized Request
Basic Info
  • Model NO.: sky037
  • Feature: Moisture Proof, Recyclable, Antistatic
  • Shape: Seal Bag
  • Raw Materials: High Pressure Polyethylene Plastic Bag
  • Size: as Per Cutomer′s Requiement
  • Printing: Machine Printing
  • Trademark: DIASAP
  • Specification: SGS RoHS report
  • HS Code: 3923210000
  • Application: Electronics
  • Material: Laminated Material
  • Making Process: Composite Packaging Bag
  • Bag Variety: Back Seal Bags
  • Thickness: Customized
  • Color: Silver
  • Transport Package: Carton
  • Origin: Suzhou City, China
Product Description
Aluminum Foil Printed Bags for IC or Chips Packing
 
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.


This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 
Product Description
Product NameAluminum Foil Printed Bags for IC or Chips Packing
 
Material Structure
Layers Laminated Material:
 
PET/AL/NY/PE  BOPP/AL/PE
FeatureAnti-static, moisture barrier,light isolation
PrintingCustomized
Surface Resistance10^6~10^11 Ohm
ThicknessCustomized(0.06--0.2mm available)
Bag StyleOpen top/ zip lock/ envelope/ gusset/ three dimensional
Package50~100pcs per bag and then in cartons or as per customer's request
 
Usage
Electronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc.
 
Aluminum Foil Printed Bags for IC or Chips Packing Technical Parameters:
NO.ItemStandardResult
1Puncture StrengthMIL-STD-3010B≥24LBF
2Surface resistivityASTM D-25710^6-10^11ohm
3Decay time IEC61340-5-1<0.3s
4WVTRASTM F1249≤0.0006g/100in²/24hs
5OTRASTM D3985≤0.01cc/100in²/24hs
6Heat-Seal Temperature 160%±10%
7Heat-Seal Pressure 70Pa
8Heat-Seal Time ≤1.5S
 
Product Pictures: 

Aluminum Foil Printed Bags for IC or Chips Packing





Factory show:
Aluminum Foil Printed Bags for IC or Chips Packing
 

Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 
Send your message to this supplier
Avatar
Ms. Ailsa
Manager
*From:
To: Ms. Ailsa
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now