| Application: | Electronics |
|---|---|
| Feature: | Moisture Proof, Recyclable, Antistatic |
| Material: | Laminated Material |
| Shape: | Seal Bag |
| Making Process: | Composite Packaging Bag |
| Raw Materials: | High Pressure Polyethylene Plastic Bag |
| Customization: |
|---|
Suppliers with verified business licenses
Audited Supplier | Product Description | |
| Product Name | ESD Moisture Barrier Bag for SMT Reel Packing |
| Material Structure |
Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE |
| Feature | Anti-static, moisture barrier,light isolation |
| Printing | Customized |
| Surface Resistance | 10^6~10^11 Ohm |
| Thickness | Customized(0.06--0.2mm available) |
| Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
| Package | 50~100pcs per bag and then in cartons or as per customer's request |
| Usage |
Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
| NO. | Item | Standard | Result |
| 1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
| 2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
| 3 | Decay time | IEC61340-5-1 | <0.3s |
| 4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
| 5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
| 6 | Heat-Seal Temperature | 160%±10% | |
| 7 | Heat-Seal Pressure | 70Pa | |
| 8 | Heat-Seal Time | ≤1.5S |
Suppliers with verified business licenses
Audited Supplier 
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