ESD Moisture Barrier Bags for Packaging Wafer

Product Details
Customization: Available
Application: Electronic Products
Material: Laminated Material
Manufacturer/Factory

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Plant Area
13000 square meters
OEM/ODM Availability
Yes
  • ESD Moisture Barrier Bags for Packaging Wafer
  • ESD Moisture Barrier Bags for Packaging Wafer
  • ESD Moisture Barrier Bags for Packaging Wafer
  • ESD Moisture Barrier Bags for Packaging Wafer
  • ESD Moisture Barrier Bags for Packaging Wafer
  • ESD Moisture Barrier Bags for Packaging Wafer
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Basic Info.

Size
as Per Cutomer′s Requiement
Thikness
as Per Cutomer′s Requiement
Feature
Bio-Degradable, Shock Resistance, Antistatic
Shape
Seal Bag
Making Process
Composite Packaging Bag
Raw Materials
High Pressure Polyethylene Plastic Bag
Bag Variety
Back Seal Bags
Transport Package
as Required
Specification
RoHS report
Trademark
DIASAP
Origin
China Suzhou
HS Code
3923290000

Product Description

ESD moisture barrier bags for packaging wafer
 
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.


This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 
Product Description
Product Name ESD moisture barrier bags for packaging wafer
 
Material Structure
Layers Laminated Material:
PET/AL/NY/PE  BOPP/AL/PE
Feature Anti-static, moisture barrier,light isolation
Printing Customized
Surface Resistance 10^6~10^11 Ohm
Thickness Customized(0.06--0.2mm available)
Bag Style Open top/ zip lock/ envelope/ gusset/ three dimensional
Package 50~100pcs per bag and then in cartons or as per customer's request
 
Usage
Electronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc.

 
 
Technical Parameters:
NO. Item Standard Result
1 Puncture Strength MIL-STD-3010B ≥24LBF
2 Surface resistivity ASTM D-257 10^6-10^11ohm
3 Decay time  IEC61340-5-1 <0.3s
4 WVTR ASTM F1249 ≤0.0006g/100in²/24hs
5 OTR ASTM D3985 ≤0.01cc/100in²/24hs
6 Heat-Seal Temperature   160%±10%
7 Heat-Seal Pressure   70Pa
8 Heat-Seal Time   ≤1.5S
 
Product Pictures: 

ESD Moisture Barrier Bags for Packaging Wafer
ESD Moisture Barrier Bags for Packaging Wafer
ESD Moisture Barrier Bags for Packaging Wafer
Packaging:
ESD Moisture Barrier Bags for Packaging Wafer



Production line:
ESD Moisture Barrier Bags for Packaging Wafer

Factory Show:


ESD Moisture Barrier Bags for Packaging Wafer
 
Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 

   

Free samples will be sent for your evaluation!   

 

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