Moisture Proof ESD Bag for Electronic Devices

• Customization: Available
• Application: Promotion, Household, Chemical, Pricise Equipment, PC Board, IC, CD Driver
• Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation
• Model NO.: SZ-MB002
• Material: Laminated Material
• Shape: Open Top, Ziplock, Three Dimensional, Gusset
• Making Process: Composite Packaging Bag
• Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE
• Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
• Function: Anti Static, Moisture Barrier, Light Isolation
• Industrial Use: Electronic Components, Semiconductive Industry
• Color: Silver
• Surface Handling: Gravure Printing
• Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
• Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
• Specification: SGS ROHS report
• Trademark: DIASAP
• Origin: China Suzhou
• HS Code: 3923210000
• Production Capacity: 200000 PCS/Day

Product Description

 Moisture Proof ESD Bag for Electronic Devices
 

This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.

This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.

 

Product Description
Product Name	Moisture Proof ESD Bag for Electronic Devices
Material Structure	Layers Laminated Material:   PET/AL/NY/PE  BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	Customized
Surface Resistance	10^8~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	Open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.

 

Technical Parameters:
 

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 

Product Pictures: 



Factory Show:

 

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