Customization: | Available |
---|---|
Size: | as Per Cutomer′s Requiements |
Thickness: | Available |
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Product Description | |
Product Name | ESD Moisture Barrier Bag for Silicon Wafer |
Material Structure |
Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE |
Feature | Anti-static, moisture barrier,light isolation |
Printing | Customized |
Surface Resistance | 10^8~10^11 Ohm |
Thickness | Customized(0.06--0.2mm available) |
Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
Package | 50~100pcs per bag and then in cartons or as per customer's request |
Usage |
Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
NO. | Item | Standard | Result |
1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
3 | Decay time | IEC61340-5-1 | <0.3s |
4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
6 | Heat-Seal Temperature | 160%±10% | |
7 | Heat-Seal Pressure | 70Pa | |
8 | Heat-Seal Time | ≤1.5S |