Laminated Antistatic Shielding Bags for Wafer Packing

Product Details
Customization: Available
Application: Promotion, Household, Chemical, Apparel, Electronic Products
Feature: Moisture Proof, Recyclable, Bio-Degradable, Disposable, Shock Resistance, Antistatic
Manufacturer/Factory

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Plant Area
13000 square meters
OEM/ODM Availability
Yes
  • Laminated Antistatic Shielding Bags for Wafer Packing
  • Laminated Antistatic Shielding Bags for Wafer Packing
  • Laminated Antistatic Shielding Bags for Wafer Packing
  • Laminated Antistatic Shielding Bags for Wafer Packing
  • Laminated Antistatic Shielding Bags for Wafer Packing
  • Laminated Antistatic Shielding Bags for Wafer Packing
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Basic Info.

Model NO.
N/A
Material
Laminated Material
Shape
Seal Bag
Making Process
Composite Packaging Bag
Raw Materials
High Pressure Polyethylene Plastic Bag
Bag Variety
Back Seal Bags
Size
as Per Cutomer′s Requiement
Thickness
Available in Customized
Transport Package
as Required
Specification
SGS RoHS report
Trademark
DIASAP
Origin
China Suzhou
HS Code
3005909000
Production Capacity
100million Ton/ Year

Product Description

Laminated Antistatic Shielding Bags for Wafer Packing
 
 This ESD shielding bags is widely used in packing of all precise components and electronic kits which are sensitive to static.
The plastic zip lock bags is easy to open, which increases customer's packing efficiency.
Translucent color is convenient to distinguish inside products.
This antistatic bags  are printed with product introduction ,company logo, and ESD warning symbol and so on.
This testing reports of packing bags are offered by the third party (SGS),the material is not harmful to environment.


Product Show:
 
Product Description
Product Name Laminated Antistatic Shielding Bags for Wafer Packing
Material Structure Layers Laminated Materials
PET-AL/PE            PET-AL/CPP
Feature Anti-static, moisture barrier
Printing Customized
Surface Resistance 10^6~10^11 Ohm
Thickness Customized
Bag Style Open top/zip lock
Package 50~100pcs per bag and then in cartons or as 
per customer's request
 
Usage
Electronic products which are sensitive to static, 
such as PC board, IC integrated circuit ,CD driver, 
HD packaging.

Technical Parameters:
NO. Item Standard Result
1 Surface resistivity ASTM D-257 10^6-10^11ohm
2 Decay time  IEC61340-5-1 <0.3s
3 Light Transmission Rate ASTM D-1003 40%±5%
4 Heat-Seal Temperature   150%±10%
5 Heat-Seal Pressure   50Pa
6 Heat-Seal Time   ≤1S
 
Product Picture:

Laminated Antistatic Shielding Bags for Wafer Packing


Factory Show:

Laminated Antistatic Shielding Bags for Wafer Packing

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Free samples will be sent for your evaluation! 

 
 

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