Moisture Proof Bags for Packaging PC Boards

• Customization: Available
• Application: Promotion, Chemical, Pricise Equipment, PC Board, IC, CD Driver
• Feature: Moisture Proof, Shock Resistance, Antistatic, Light Isolation
• Model NO.: SZ-MB002
• Material: Laminated Material
• Shape: Open Top, Ziplock, Three Dimensional, Gusset
• Making Process: Composite Packaging Bag
• Raw Materials: Pet/Al/Ny/PE BOPP/Al/PE
• Bag Variety: Open Top, Ziplock, Three Dimensional, Gusset
• Function: Anti Static, Moisture Barrier, Light Isolation
• Industrial Use: Electronic Components, Semiconductive Industry
• Color: Silver
• Surface Handling: Gravure Printing
• Bag Type: Open Top, Zip Lock, Three Dimensional, Gusset
• Transport Package: 50 - 100PCS Per Bag, 5 - 50 Bags / Carton
• Specification: SGS RoHS report
• Trademark: DIASAP
• Origin: China Suzhou
• HS Code: 3923210000
• Production Capacity: 200000 PCS/Day

Product Description

Moisture Proof Bags for Packaging PC Boards

 

1.This Al bag to protect electronic products from moisture is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.
 

2.The bag is mainly applied to pack electronic components(PCB,IC,HD driver), precise equipment and chemical raw material etc.

3.The third party reports can be offered, such as ROHS,Halogen testing report.

 
 

Product Description
Product Name	Moisture Proof Bags for Packaging PC Boards
Material Structure	Layers Laminated Material:   PET/AL/NY/PE  BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	customized
Surface Resistance	10^6~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as  per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment  and chemical raw material etc.

 
 
 

Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 
 

Product Pictures: 



Factory Show:

 

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7.     Cleanroom  Consumable Series

 
 

 

Free samples will be sent for your evaluation!