Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging

Product Details
Customization: Available
Material: PE
Application: Electronics
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Manufacturer/Factory

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Plant Area
13000 square meters
OEM/ODM Availability
Yes
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
  • Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
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  • Overview
  • Detailed Photos
Overview

Basic Info.

Thickness
Available in Customized
Color
Per Customer′s Requirements
Length
as Required
Transport Package
as Required
Specification
Customized size
Trademark
DIASAP
Origin
Suzhou, China
Production Capacity
100million Tonf Year

Product Description

Product Features
Anti static, moisture-proof, and static protection.Protect sensitive electronic devices from physical damage caused by electrostatic discharge during storage and transportation

 
Application scope
 
 


 
Detailed Photos

 

Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
 
Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging


 
 
Red Anti-Static Bubble Bag Double-Layer Bubble Film Circuit Board Packaging
 
 

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