• Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
  • Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
  • Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
  • Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
  • Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
  • Moisture Proof Moisture Barrier Bags for Packaging Electronic Components

Moisture Proof Moisture Barrier Bags for Packaging Electronic Components

Application: Electronic Products
Feature: Moisture Proof, Recyclable, Disposable, Antistatic
Material: Laminated Material
Shape: Plastic Bags
Making Process: Composite Packaging Bag
Raw Materials: High Pressure Polyethylene Plastic Bag
Samples:
US$ 0.018/Piece 1 Piece(Min.Order)
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Customization:
Diamond Member Since 2015

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Manufacturer/Factory

Basic Info.

Model NO.
MBB009
Bag Variety
Upright Bag
Transport Package
100 PCS/Bag
Specification
Customized size
Trademark
DIASAP
Origin
China Suzhou
HS Code
3923210000
Production Capacity
30 Tons/ Year

Product Description

This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.

This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
 
Product Name
ESD ziplock moisture barrier bag with printing
Material Structure
PET/AL/NY/PE BOPP/AL/PE
Feature
Anti-static, moisture barrier,light isolation
Printing
Customized
Surface Resistance
10^6~10^11 Ohm
Thickness
Customized(0.06--0.2mm available)
Bag Style
Open top/Ziplock
Usage
Electronic components (PCB, IC, HD driver), precise equipment components


Moisture Proof Moisture Barrier Bags for Packaging Electronic ComponentsMoisture Proof Moisture Barrier Bags for Packaging Electronic Components


Moisture Proof Moisture Barrier Bags for Packaging Electronic Components
Main Features
:

1)It is applied to pack PCB, wafer, IC, large precise mechanical equipment, chemical raw material, medical intermediate and so on. 
2)The film has four-layer structure which is featured of good moisture barrier and light shielding property. 
3)The film can be made into various shapes such as zip-lock bag, flat open bag, gusset bag, and 3D bag etc.
4) Film thickness can be customized with enough MOQ. Professional packing solution is available here.

Application:
Moisture Proof Moisture Barrier Bags for Packaging Electronic Components

Customer visit:
Moisture Proof Moisture Barrier Bags for Packaging Electronic Components

Factory show:
Moisture Proof Moisture Barrier Bags for Packaging Electronic Components

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