Plastic Ziplock Bag for Packaging Flip Chip

Product Details
Customization: Available
Application: Chemical, PC Board, IC, CD Driver, HD Pack
Material: Laminated Material
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Plant Area
13000 square meters
OEM/ODM Availability
Yes
  • Plastic Ziplock Bag for Packaging Flip Chip
  • Plastic Ziplock Bag for Packaging Flip Chip
  • Plastic Ziplock Bag for Packaging Flip Chip
  • Plastic Ziplock Bag for Packaging Flip Chip
  • Plastic Ziplock Bag for Packaging Flip Chip
  • Plastic Ziplock Bag for Packaging Flip Chip
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Basic Info.

Model NO.
SZ-S001
Function
Anti Static
Industrial Use
Electronic Components, Semiconductive Industry
Color
Semi-Transparent
Surface Handling
Gravure Printing
Bag Type
Open Top, Zip Lock
Feature
Antistatic, Moisture Proof
Shape
Open Top, Zip Lock
Making Process
Composite Packaging Bag
Raw Materials
APET/PE APET/CPP
Bag Variety
Open Top Bag, Zip Lock Bag
Transport Package
50 - 100PCS Per Bag, 5 - 50 Bags / Carton
Specification
SGS ROHS report
Trademark
DIASAP
Origin
Suzhou, China
HS Code
3923210000
Production Capacity
200000 PCS/Day

Product Description

Plastic Ziplock Bag for Packaging Flip Chip
 

This ESD shielding bags is widely used in packing of all precise components and electronic kits which are sensitive to static.

The plastic ESD bag is easy to open, which increases customer's packing efficiency.
Translucent color is convenient to distinguish inside products.
This antistatic bags  are printed with product introduction ,company logo, and ESD warning symbol and so on.
This testing reports of packing bags are offered by the third party (SGS),the material is not harmful to environment.
 
Product Description
Product Name Plastic Ziplock Bag for Packaging Flip Chip
Material Structure Layers Laminated Materials
PET-AL/PE            PET-AL/CPP
Feature Anti-static
Printing Customized
Surface Resistance 10^6~10^11 Ohm
Thickness Customized
Bag Style Open top/zip lock
Package 50~100pcs per bag and then in cartons or as per customer's request
Usage Electronic products which are sensitive to static, such as PC board, IC integrated circuit ,CD driver, HD packaging.
 
Technical Parameters:
 
NO. Item Standard Result
1 Surface resistivity ASTM D-257 10^6-10^11ohm
2 Decay time IEC61340-5-1 <0.3s
3 Light Transmission Rate ASTM D-1003 40%±5%
4 Heat-Seal Temperature   150%±10%
5 Heat-Seal Pressure   50Pa
6 Heat-Seal Time   ≤1S
 
 
Product Picture:

Plastic Ziplock Bag for Packaging Flip Chip
Plastic Ziplock Bag for Packaging Flip Chip



Factory show:

Plastic Ziplock Bag for Packaging Flip Chip

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4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 

Contact us:
Abby 
Suzhou SKY Industrial Co., Ltd.
Add.: 36# Zhong'An Road, Puzhuang, Suzhou, Jiangsu, China
Zip code: 215105
Tel: +8613270975606
 


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