IC Chip Packaging, Round Box, Moisture-Proof Vacuum Aluminum Foil, Electrostatic Three-Dimensional Packaging Bag

• Customization: Available
• Size: as Per Cutomer′s Requiements
• Thickness: Available
• Printing: Machine Printing
• Color: Silver
• Application: Electronic Products, Promotion
• Feature: Shock Resistance, Recyclable, Moisture Proof
• Material: Laminated Material
• Shape: Seal Bag
• Making Process: Composite Packaging Bag
• Raw Materials: High Pressure Polyethylene Plastic Bag
• Bag Variety: Back Seal Bags
• Transport Package: as Required
• Specification: ROHS report
• Trademark: DIASAP
• Origin: China Suzhou
• HS Code: 3923210000
• Production Capacity: 100million Ton/ Year

Product Description

ESD Moisture Barrier Bag for Silicon Wafer with SGS

 

This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.
ts the environment requirement of EU and North America in package.
 

 

Product Description
Product Name	ESD Moisture Barrier Bag for Silicon Wafer
Material Structure	Layers Laminated Material:   PET/AL/NY/PE  BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	Customized
Surface Resistance	10^8~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	Open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.

 
 

Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 

Product Pictures: 

Factory Show:

 

Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series
 
 


Free samples will be sent for your evaluation!