Jiangsu, China
Business Type:
Manufacturer/Factory & Trading Company
Business Range:
Bags, Cases & Boxes, Electrical & Electronics, Industrial Equipment & Components, ...
Management System Certification:
OEM/ODM Service
Sample Available

Moisture Barrier Bag, Packaging Bag, Zipper Bag manufacturer / supplier in China, offering Aluminum Foil Printed Bags for IC or Chips Packing, ESD Moisture Barrier Bag for Electronic Components, Antistatic Square Bottom Bags and so on.

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Supplier Homepage Products Packaging Bags Aluminum Foil Printed Bags for IC or Chips Packing

Aluminum Foil Printed Bags for IC or Chips Packing

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Purchase Qty. / Reference FOB Price
1,000-3,999 Pieces US $0.2
4,000+ Pieces US $0.1
Port: Shanghai, China
Production Capacity: 60tons/Month
Payment Terms: T/T
Application: Electronics
Feature: Moisture Proof, Recyclable, Antistatic
Material: Laminated Material
Shape: Seal Bag
Making Process: Composite Packaging Bag
Raw Materials: High Pressure Polyethylene Plastic Bag

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Basic Info

Model NO.: sky037
Bag Variety: Back Seal Bags
Size: as Per Cutomer′s Requiement
Thickness: Customized
Printing: Machine Printing
Color: Silver
Trademark: DIASAP
Transport Package: Carton
Specification: SGS RoHS report
Origin: Suzhou City, China
HS Code: 3923210000

Product Description

Aluminum Foil Printed Bags for IC or Chips Packing
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components

(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.

This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.
Product Description
Product NameAluminum Foil Printed Bags for IC or Chips Packing
Material Structure
Layers Laminated Material:
FeatureAnti-static, moisture barrier,light isolation
Surface Resistance10^6~10^11 Ohm
ThicknessCustomized(0.06--0.2mm available)
Bag StyleOpen top/ zip lock/ envelope/ gusset/ three dimensional
Package50~100pcs per bag and then in cartons or as per customer's request
Electronic components (PCB, IC, HD driver),precise equipment
and chemical raw material etc.
Aluminum Foil Printed Bags for IC or Chips Packing Technical Parameters:
1Puncture StrengthMIL-STD-3010B≥24LBF
2Surface resistivityASTM D-25710^6-10^11ohm
3Decay time IEC61340-5-1<0.3s
4WVTRASTM F1249≤0.0006g/100in²/24hs
5OTRASTM D3985≤0.01cc/100in²/24hs
6Heat-Seal Temperature 160%±10%
7Heat-Seal Pressure 70Pa
8Heat-Seal Time ≤1.5S
Product Pictures: 

Aluminum Foil Printed Bags for IC or Chips Packing

Factory show:
Aluminum Foil Printed Bags for IC or Chips Packing

Other related products:
1.     Moisture barrier Bags/Aluminum Foil Bag
2.     ESD Bubble Cushioned Bag
3.     Nylon Bag/Vacuum Bag
4.     Air Bubble Bag/making machine
5.    Industrial Cotton Swab Series 
6.    Humidity Indicator Card
7.    Cleanroom  Consumable Series

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