Aluminum Foil Printed Bags for IC or Chips Packing

• Customization: Available
• Application: Electronics
• Feature: Moisture Proof, Recyclable, Antistatic
• Model NO.: sky037
• Material: Laminated Material
• Shape: Seal Bag
• Making Process: Composite Packaging Bag
• Raw Materials: High Pressure Polyethylene Plastic Bag
• Bag Variety: Back Seal Bags
• Size: as Per Cutomer′s Requiement
• Thickness: Customized
• Printing: Machine Printing
• Color: Silver
• Transport Package: Carton
• Specification: SGS RoHS report
• Trademark: DIASAP
• Origin: Suzhou City, China
• HS Code: 3923210000
• Production Capacity: 60tons/Month

Product Description

Aluminum Foil Printed Bags for IC or Chips Packing
 

This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.

This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.

This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.

This laminated bag can print all symbols and can be customized according to customers' request.

This third party reports can be offered, such as ROHS, Halogen testing report. This material meets the environment requirement of EU and North America in package.

 

Product Description
Product Name	Aluminum Foil Printed Bags for IC or Chips Packing
Material Structure	Layers Laminated Material:   PET/AL/NY/PE  BOPP/AL/PE
Feature	Anti-static, moisture barrier,light isolation
Printing	Customized
Surface Resistance	10^6~10^11 Ohm
Thickness	Customized(0.06--0.2mm available)
Bag Style	Open top/ zip lock/ envelope/ gusset/ three dimensional
Package	50~100pcs per bag and then in cartons or as per customer's request
Usage	Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc.

 

Aluminum Foil Printed Bags for IC or Chips Packing Technical Parameters:

NO.	Item	Standard	Result
1	Puncture Strength	MIL-STD-3010B	≥24LBF
2	Surface resistivity	ASTM D-257	10^6-10^11ohm
3	Decay time	IEC61340-5-1	<0.3s
4	WVTR	ASTM F1249	≤0.0006g/100in²/24hs
5	OTR	ASTM D3985	≤0.01cc/100in²/24hs
6	Heat-Seal Temperature		160%±10%
7	Heat-Seal Pressure		70Pa
8	Heat-Seal Time		≤1.5S

 

Detailed Photos

 

Factory show:

 

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